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Low-temperature growth of boron carbide coatings by direct current magnetron sputtering and high-power impulse magnetron sputtering

机译:直流磁控溅射和大功率脉冲磁控溅射在碳化硼涂层上的低温生长

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摘要

B4C coatings for B-10-based neutron detector applications were deposited using high-power impulse magnetron sputtering (HiPIMS) and direct current magnetron sputtering (DCMS) processes. The coatings were deposited on Si(001) as well as on flat and macrostructured (grooved) Al blades in an industrial coating unit using B4C compound targets in Ar. The HiPIMS and DCMS processes were conducted at substrate temperatures of 100 and 400 A degrees C and the Ar pressure was varied between 300 and 800 mPa. Neutron detector-relevant coating characterization was performed and the coating properties were evaluated with regard to their growth rate, density, level of impurities, and residual coating stress. The coating properties are mainly influenced by general process parameters such as the Ar pressure and substrate temperature. The deposition mode shows only minor effects on the coating quality and no effects on the step coverage. At a substrate temperature of 100 A degrees C and an Ar pressure of 800 mPa, well-adhering and functional coatings were deposited in both deposition modes; the coatings showed a density of 2.2 g/cm(3), a B/C ratio of similar to 3.9, and the lowest compressive residual stresses of 180 MPa. The best coating quality was obtained in DCMS mode using an Ar pressure of 300 mPa and a substrate temperature of 400 A degrees C. Such process parameters yielded coatings with a slightly higher density of 2.3 g/cm(3), a B/C ratio of similar to 4, and the compressive residual stresses limited to 220 MPa.
机译:使用大功率脉冲磁控溅射(HiPIMS)和直流磁控溅射(DCMS)工艺沉积用于B-10-型中子探测器的B4C涂层。使用Ar中的B4C化合物靶,将涂层沉积在工业涂层装置中的Si(001)以及平面和宏观结构(开槽)的Al刀片上。 HiPIMS和DCMS工艺在100和400 A的基板温度下进行,并且Ar压力在300和800 mPa之间变化。进行与中子探测器相关的涂层表征,并根据其生长速率,密度,杂质含量和残余涂层应力评估涂层性能。涂层性能主要受一般工艺参数(例如Ar压力和基材温度)的影响。沉积模式仅显示对涂层质量的微小影响,而对台阶覆盖率没有影响。在100 A的基板温度和800 mPa的Ar压力下,以两种沉积方式沉积具有良好附着力的涂层和功能涂层。涂层的密度为2.2 g / cm(3),B / C比率类似于3.9,最低残余压缩应力为180 MPa。在DCMS模式下使用300 mPa的Ar压力和400 A的基材温度可获得最佳的涂层质量。此类工艺参数产生的涂层的密度稍高,为2.3 g / cm(3),B / C比类似于4,压缩残余应力限制为220 MPa。

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